Leading embedded consultancy showcases third-generation pipe thickness monitoring technology
ByteSnap Design, a renowned embedded consultancy, will be showcasing their latest innovation, the third-generation WAND Handheld Data Collector (WAND HDC), at the Engineering Design Show in Coventry this October. The revolutionary industrial sensor, developed in collaboration with King’s Award for Innovation winner Inductosense, represents a significant advancement in pipe wall thickness monitoring technology and will be available for demonstration at stand H52.
The WAND HDC, building on the success of the ELEKTRA 2022 IoT Product of the Year-winning WAND RDC, is one of the most advanced handheld industrial sensors of its generation. This breakthrough technology is a result of the collaboration between Inductosense’s patented sensing innovation and ByteSnap Design’s embedded systems expertise, showcasing British engineering excellence and driving global industrial IoT advancement.
ByteSnap Design’s comprehensive redesign has significantly improved the device’s performance, including lower unit costs, increased operating speeds, extended battery life, enhanced high-speed communications, and an intuitive new user interface. The WAND HDC also meets the latest IoT cybersecurity requirements, making it ideal for industrial deployments.
Dunstan Power, Director at ByteSnap Design, said, “This project is a testament to the power of British engineering collaboration. Working with Inductosense, a King’s Award winner at the forefront of industrial sensing innovation, we have been able to apply our embedded systems expertise to enhance nearly every aspect of their already exceptional technology. This represents a classic improvement of an existing product using the latest technology to achieve maximum resilience and world-class performance.”
Inductosense, a University of Bristol spin-out founded in 2015, has established itself as a leader in wireless corrosion monitoring with over 40 employees and thousands of WAND sensors deployed globally across various sectors, including oil & gas, chemical, mining, renewables, and nuclear. The company’s remarkable journey from a research project to King’s Award recognition demonstrates the transformative potential of British innovation.
ByteSnap Design, with over 17 years of experience and award-winning expertise in embedded Linux, IoT, ATEX & FPGA development, and cybersecurity, has played a crucial role in the redesign of the WAND HDC. The company’s deep technical knowledge has enabled significant performance breakthroughs, making the third-generation device a market leader.
Dr. Chenghuan Zhong, founder and Chief Technology Officer at Inductosense, said, “The collaboration between Inductosense’s first-class sensing innovation and ByteSnap’s embedded engineering mastery has produced something truly exceptional. This third-generation device wouldn’t exist without ByteSnap’s technical excellence in electronics design and its deep understanding of what industrial environments demand.”
The WAND HDC is a game-changer in critical infrastructure monitoring, providing continuous and accurate monitoring of internal corrosion and erosion, which can lead to major operational risks. Unlike traditional manual inspection methods, the WAND system enables predictive maintenance, ultimately preventing costly unplanned shutdowns.
Industry professionals are invited to visit ByteSnap’s stand H52 to witness this exceptional collaboration in action. Visitors will have the opportunity to see how ByteSnap’s embedded systems mastery, combined with Inductosense’s innovative sensing technology, is driving the future of industrial IoT.
Dunstan Power, Director at ByteSnap, will also be speaking at the event on 8 October in a session entitled Breaking the Reactive Cycle: Strategic Approaches to Component Obsolescence Management. He will also be a panellist on the supply chain forum discussion on 9 October, where he will talk about supply chain security and resilience in the age of tariffs and moving goal posts.
For more information or to arrange a demonstration at stand H52, contact ByteSnap Design at info@bytesnap.co.uk or visit www.bytesnap.com.
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About Inductosense
Inductosense, founded as a University of Bristol spin-out in 2015, is a King’s Award for Innovation winner that designs and manufactures wireless, battery-free ultrasonic sensors for monitoring internal corrosion, cracks, and erosion. With over 40 employees and thousands of sensors deployed globally, the company helps its customers reduce costs and digitalize their corrosion monitoring.
About ByteSnap Design
ByteSnap Design, with over 17 years of experience, is one of the UK’s leading electronics engineering consultancies, trusted by businesses worldwide to develop next-generation technology products. The company’s award-winning expertise includes embedded Linux, IoT, ATEX & FPGA development, and cybersecurity, delivering world-class embedded systems for clients ranging from innovative start-ups to global corporations.
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